Out on the line, water marks and particle re-deposition after CMP still knock out yield. More often than not, the culprit is an unstable thermal profile during drying. We built our post-CMP wafer drying heater to take that variability out of the equation—not add to it. What matters, technically We run short-wave infrared elements behind a quartz window, so the energy hits the wafer directly and fast—without overshooting the substrate. Across the active zone, we hold wafer-level uniformity within ±0.1°C, and repeatability stays locked because a calibrated closed-loop control tracks setpoint against actual temperature in real time. The unit fits Class 1–100 cleanrooms, and the materials and seals are chosen to keep particle generation at zero once you’re in steady state. Why it works in post-CMP drying The job is simple: strip off the rinse film cleanly, quickly, and without residue. Tight thermal control makes surface tension behave the same way, lot after lot—and that directly cuts defects. That same stability pays off downstream in photoresist. Soft bake and hard bake profiles stay consistent, so you don’t see critical dimension drift or line-edge roughness wander. The heater also runs 24/7 without surprise downtime, which keeps throughput steady and maintenance predictable. Things you should know up front Installation comes down to matching chamber geometry and getting the coolant and exhaust interfaces right. We provide the interface drawings, but you still need to do the fit-check on the floor. Plan on a short warm-up to hit thermal equilibrium before the first batch. That’s the trade you make for the repeatability you need. Once it’s aligned, the unit keeps the thermal budget under control and leaves the process window intact.