On the lithography floor, EUV resist processing doesn’t forgive thermal drift. Soft bake runs a degree hot? Hard bake drifts across the wafer? You start losing yield—quietly, and in a way that repeats shift after shift. The heater components under the resist have to deliver repeatable temperature, across shifts and across lots, without dumping particles or racking up downtime. What matters under the hood We build the EUV resist heater around controlled infrared sources—short-wave and medium-wave—paired with quartz windows and halogen elements chosen for stable spectral output. The payoff is wafer-level thermal uniformity within ±0.1°C across the resist surface, and bake profiles that repeat inside tolerance. The package is cleanroom-ready for Class 1–100, with materials and finishes selected to keep particle generation at zero during operation. Output is matched to standard power and voltage windows, and connector options fit existing bake tracks so a swap-in doesn’t force a rewire. Why this works for EUV resist EUV resist stacks are thin and the thermal budget is tight. Precision beats brute power. We hold the bake temperature where the process spec says it should be, not where drift takes it. That means tighter critical dimension control, fewer scum and footing defects, and line-of-sight yield that behaves itself. Equally important, the heater runs 24/7 without unplanned stops—no hot spots, no interlocks, no surprise maintenance calls that stall the tool. What you need to plan for Installation is straightforward on standard tracks, but the heater has to match the chamber geometry and the IR path. Expect a short commissioning run to lock in bake profiles and confirm uniformity maps. The operating life is long—5,000+ hours is typical—but preventive calibration is still necessary to hold ±0.1°C across wafer diameters. Build that calibration window into the schedule; the return is stable EUV exposures, shift after shift.